Lawrence Berkeley National Laboratory

MET5

The MET5 tool in cleanroom

The MET5 is a 0.5-NA EUV (13.5 nm) projection lithography tool located at the Advanced Light Source. With a unique lossless programmable coherence illuminator that enables world-leading 8 nm half-pitch imaging resolution, the MET5 serves as the primary experimental platform for photoresist evaluation, stochastic defect studies, and EUV imaging research at CXRO. For a new lithography technology to succeed, the supporting ecosystem must be developed years in advance; the MET5 gives researchers from around the world that essential early learning in resists, processing, and masks.

Virtual Tour

Explore the MET5 cleanroom and tool in 3D with this interactive Matterport virtual tour.

MET Users Portal

Access scheduling, documentation, and resources for MET5 users at met.lbl.gov

Instrument Specifications

Source13.5 nm (EUV), ALS BL 12.0.1.4 or Energetiq EQ-10 Z-pinch
Optics0.5-NA isomorphic Schwarzschild optic
Resolution8 nm (1-D); 11 nm (2-D)
Field Size200 × 30 μm
IlluminationProgrammable illumination, F2X (pseudo-PS)
Throughput4–5 wafers per shift
Operating Schedule10 eight-hour shifts per week
Wafer Format200-mm wafers or 2″ × 2″ coupons

Key Capabilities

Photoresist Evaluation

The MET prints high-resolution patterns in candidate photoresists, enabling characterization of sensitivity, resolution, LER, and stochastic defect rates under realistic EUV imaging conditions.

SEM image of anisotropic three-dimensional line-edge roughness
3D SEM of typical resist line-edge roughness (LER), a key factor in EUV process yield.

Resolution Leadership

The MET5’s 0.5-NA optic and programmable coherence illuminator reach down to 8 nm half-pitch resolution, giving researchers an unparalleled view into the future of photolithography. Materials researchers have used the MET5 to develop photoresists capable of sub-10 nm dense patterning using conventional lithography.

SEM image demonstrating 13 nm dense patterning using the Berkeley MET
8-nm lines and spaces and 11-nm pillars

Flexible Illumination

Customized illumination including F2X, dipole, multipole, and SMO-type pupil fills optimally image all varieties of mask features.

Full Process Window Analysis

Materials are shot through focus and through dose to establish full process windows on new materials.

Related Research

See EUV Lithography Science for the science programs that use the MET5.

MET Team